Electroless Nickel Electroless Palladium Immersion Gold
ENEPIG proves highly beneficial for IC package PCB substrates, offering greater flexibility and density without the need for bussing lines, unlike electrolytic methods.
The ENEPIG process offers numerous advantages. It’s immune to “black nickel,” preventing grain boundary corrosion caused by immersion gold. With high wire bond pull strengths, it’s ideal for aluminum wedge or gold ball bonding. Components can be connected without solder, ensuring versatility. Moreover, it withstands multiple lead-free reflow soldering cycles, enhancing durability. Its uniform electrical resistance results in low contact resistance, facilitating easier amperage prediction. Notably, ENEPIG boasts an unlimited shelf life, remaining untarnished over time.
Choosing ENEPIG finishes offers numerous benefits. Talon, an electro-less and auto-catalytic palladium, is cost-effective, wire-bondable, and highly stable. It can be deposited directly on copper or electro-less nickel substrates. GoBright TWX-40 gold electrolyte optimizes the ENIG process when plating on electro-less palladium depositions. Altarea TPD-21, an autocatalytic electro-less palladium bath, is excellent for surface mount applications, offering superb wire bonding and soldering capabilities. The KAT UF ENEPIG universal finish, comprising Ni/Pd/Au layers, stands out for its exceptional solderability, wire bondability with aluminum and gold, and outstanding contact surface properties.