What is Sequential lamination? Sequential lamination  is a specialized technique used in the production of High-Density Interconnect (HDI) circuit boards. If you are looking for materials for your HDI application, we offer various options for RF & Microwave Designs, Sequential HDI with up to 32 layers PCB Fab. Rogers, Isola, Panasonic, AGC, Hybrid – FR4/ Ceramic, PTFE, Polyimide, and more.

Highly Advanced Multilayer HDI PCB Fabrication capabilities

Sequential lamination is a specialized technique used in the production of High-Density Interconnect (HDI) circuit boards. This method involves meticulously stacking layers of copper and insulating materials in a specific sequence. The goal is to construct multi-layer PCBs that are both compact and highly efficient. our expertise and capability of producing a variety of HDI circuits from the simplest of circuit boards to highly advanced circuitry.

We are dedicated to satisfying your needs and have provided solutions for the Aerospace, Automotive, Computer, Green Energy, Industrial, LED, Medical, Telecommunications and Transportation industries.

We provide boards that are Class III and can provide quick turns on digital boards fast, depending on the complexity of the board. Whether you need LED or FR4 PCB, our shop capabilities have got you covered.

If you are looking for multi-layer, single, and/or double sided RF metal core PCBs, contact Precision PCB to review your project today.